Topic
Semiconductor Industry
203 published works
The Right Coast
It s the Most Indispensable Machine in the World and It Depends on This Woman – WSJ
BOISE, Idaho Brienna Hall has the most valuable role that you ll never see at the most vital company that you ve never heard of. Until she began working at ASML…
SmarTrade
USTR Initiates Section 301 Investigation on China’s Targeting of the Semiconductor Industry
By Scott E. Diamond**, Aaron C. Mandelbaum
On December 23, 2024, the Office of the U.S. Trade Representative (USTR) announced it was initiating an investigation into China’s acts, policies, and practices related to China’s targeting of the…
Global Trade Law Blog
The Persistence of (High Bandwidth) Memory: Semiconductor Manufacturing Equipment and Korean Semiconductor Manufactures Face Harsher Restrictions Under New HBM Rules
By Jordan Mallory, Reid Whitten
On December 2, 2024, the Department of Commerce, Bureau of Industry and Security (BIS) issued a new set of regulations targeting semiconductors manufacturing equipment (SME) and high-bandwidth memory (HBM) chips.…
SmarTrade
BIS Seeks to Further Strengthen Export Controls Targeting China’s Advanced Semiconductor Industry
By Scott E. Diamond**, Francesca M.S. Guerrero, Samir D. Varma, Aaron C. Mandelbaum
On December 2, 2024, the Department of Commerce’s Bureau of Industry and Security (BIS) issued two new rulemakings in an ongoing effort to “further impair [China’s] capability to produce advanced-node…
China Law Insight
详解美国半导体出口管制新规，全球半导体供应链直面大变局
By King & Wood
作者：戴梦皓 陈若思 曹逸晨 2024年12月2日，在经过将近半年的准备之后，美国商务部产业安全局（“BIS”）终于发布了关于先进计算半导体与半导体制造物项出口管制临时新规（“AC/S & SME IFR”）的最新修订。在经历了2022年10月7日、2023年10月17日和2024年3月29日三轮修订后，本次修订预计将成为拜登政府任期内的最后一次AC/S & SME IFR的重大修订。而正如美国商务部部长雷蒙多在12月1日的一次电话会中所述：“我们（本届政府）已使得BIS前所未有地变得更为强力、更为战略性、更为有效……（本次修订）将让下届政府做好准备，以延续保护美国科技安全和领导力的重要势头”，拜登政府在任期最后时刻公布相关新规，其计划将AC/S & SME IFR作为其在出口管制领域的重要政治遗产的意味也昭然若揭。那么，作为最新一次修订，本次新规是否能够完成拜登政府预想的关于对华半导体出口管制的重要拼图，新一届美国政府是否真的会在出口管制问题上萧规曹随，我们将结合本次新规的修订内容和相关背景，为大家带来我们的分析和见解，希望能够对大家有所帮助。 阅读更多
Cleary Foreign Investment and International Trade Watch
You’re Invited: U.S. Outbound Investment Security Program Webinar on December 16, 2024
The Treasury Department has released its “Final Rule” which will impose on U.S. persons notification requirements and restrictions for transactions involving entities engaged in activities relating to semiconductors and microelectronics,…
Internet, IT & e-Discovery
IBM is developing new AI chips with Co-Packaged Optics (CPO)!
By Peter Vogel
Networkworld.com reported that “IBM researchers are developing optical chips that are expected to significantly speed connectivity in data center systems, enabling better performance and lower energy costs for customers that…
Trade Compliance Resource Hub
BIS further targets China’s ability to produce advanced semiconductors; China retaliates with its own export bans
By Michael Lowell, Lizbeth Rodriguez-Johnson, Paula Salamoun, Justin Angotti, Kirsten Lowell
On December 2, the Bureau of Industry and Security (BIS) announced two companion rules to impede China’s ability to procure and produce advanced-node semiconductors that can be used in advanced…
The CLS Blue Sky Blog
Gibson Dunn Discusses New U.S. Outbound Investment Regulations
By Stephenie Gosnell Handler, Adam M. Smith, Christopher T. Timura, Michelle Weinbaum, Hugh Danilack, Publisher, Chris Mullen
On October 28, 2024, the U.S. Department of the Treasury issued final regulations implementing an outbound investment control regime targeting AI, semiconductors, and quantum computing investments involving China that raise…
Global Supply Chain Law Blog
Where Are My Chips?
Please contact Tim Flamank with any questions. If you subscribe to the view that Artificial Intelligence (AI) is going to change life as we know it, then you will have…